X-ray Inspection

Brief introduction:

X - Ray is using a cathode Ray tube to produce high energy electron striking a metal target. In the process of impact, because of the sudden slowdown of electronic, the loss of kinetic energy will be released in the form of X - Ray.

Purposes:

To test the internal cracks and defects of foreign body in metal materials and parts, plastic materials and parts, electronic components, electronic components, LED components; analyze the internal displacement in BGA and circuit boards; distinguish BGA welding defects such as empty welding, pseudo welding; analyze the internal situation of microelectronic systems and rubber seal components, cables, fittings, plastic pieces etc.

Applications:

IC, BGA, PCB/PCBA, and surface-mount technology weldability test etc.

Reference standard:

IPC-A-610 ,GJB 548B

Typical test images:

BGA voids	BGA tin ball cracking
PCB line disconnection	Check the IC defect